Mr Nicholas Nugent
- Research Assistant (Electronic & Nanoscale Engineering)
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Nugent, N., Bronstein, J., Paul, J. , Kennedy, O., Dimitriadis, S., Lindstrom, T., Weides, M. and Connolly, M. (2023) Flip-Chip Integration for Quantum Circuits. Superconducting Quantum Devices in the UK 2023 (SQD2023), Glasgow, UK, 06-07 Jul 2023.
Weides, M. et al. (2022) 3D Integration of Superconducting Chips with Through Silicon Vias. 35th Integration Symposium on Superconductivity (ISS2022), Nagoya, Japan, 29 Nov - 01 Dec 2022.
Nugent, N. et al. (2022) Atomic Layer Deposited Niobium and Titanium Nitrides for Superconducting Resonators and Superconducting Through Silicon Vias. American Physical Society March Meeting 2022, Chicago, IL, USA, 14-18 Mar 2022.
Seferai, V. et al. (2022) Tantalum on Sapphire and Silicon Substrates for Superconducting Quantum Circuits. American Physical Society March Meeting 2022, Chicago, IL, USA, 14-18 Mar 2022.
Nugent, N., Bronstein, J., Paul, J. , Kennedy, O., Dimitriadis, S., Lindstrom, T., Weides, M. and Connolly, M. (2023) Flip-Chip Integration for Quantum Circuits. Superconducting Quantum Devices in the UK 2023 (SQD2023), Glasgow, UK, 06-07 Jul 2023.
Weides, M. et al. (2022) 3D Integration of Superconducting Chips with Through Silicon Vias. 35th Integration Symposium on Superconductivity (ISS2022), Nagoya, Japan, 29 Nov - 01 Dec 2022.
Nugent, N. et al. (2022) Atomic Layer Deposited Niobium and Titanium Nitrides for Superconducting Resonators and Superconducting Through Silicon Vias. American Physical Society March Meeting 2022, Chicago, IL, USA, 14-18 Mar 2022.
Seferai, V. et al. (2022) Tantalum on Sapphire and Silicon Substrates for Superconducting Quantum Circuits. American Physical Society March Meeting 2022, Chicago, IL, USA, 14-18 Mar 2022.