List of Equipment available through ANALOGUE

This section highlights each major piece of equipment

 

  • Automated Die Bonder

  • Automated Wire Bonder

  • Automated Bond Tester

  • Surface Grinder

  • Dicing Tools

  • 3D Printed Electronics Systems

  • Additive Heterogeneous Packaging Systems

  • High-Resolution Printed Circuit Laser Patterning

  • Wafer-Scale Electrical Characterization Systems

Dicing Tool-Disco 3350

Dicing Tool-Disco 3350

DAD3350 can handle a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). Selecting a 2.2 kW high-torque spindle (optional) makes it possible to process silicon up to difficult-to-process materials, such as ceramic. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. Through condition monitoring the processing conditions and various other statuses can be known at any given time.

CAPABILITIES: To improve equipment productivity, auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed.